Kini kita dimomokkan dengan berita-berita dan iklan sana sini berkenaan processor baru oleh intel. Adakah kita tahu bahawa processor tersebut adalah tidak sama soketnya dengan Core2 Duo ataupun QuardCore. Socket ini menggunakan LGA775. Oleh yang demikian kita tidak boleh upgrada komputer tanpa menukar papan utama (motherboard).
Core i3, Core i5 dan Core i7 menggunakan socket yang lain. Dibawah ini saya sertakan serba ringkas processor, code nama dan soket. Jadual ini hanya rujukan sahaja dimana untuk penjelasan lebih lanjut boleh rujuk di laman sesawang Intel.
Core i3
Codename | Brand name (list) | Cores | L3 Cache | Socket | TDP |
Clarkdale | Core i3-5xx | 2 | 4 MB | LGA 1156 | 73 W |
Arrandale | Core i3-3xxM | | 3 MB | µPGA-989 | 35 W |
Sandy Bridge (Desktop) | Core i3-21xx | 2 | 3 MB | LGA 1155 | 65 W |
| Core i3-21xxT | 2 | 3 MB | LGA 1155 | 35 W |
Core i5
Codename | Brand name (list) | Cores | L3 Cache | Socket | TDP |
Lynnfield | Core i5-7xx | 4 | 8 MB | | 95 W |
| Core i5-7xxS | | | LGA 1156 | 82 W |
Clarkdale | Core i5-6xx | | 4 MB | | 73-87 W |
| Core i5-4xxM | 2 | | | |
Arrandale | Core i5-5xxM | | 3 MB | PGA-988/BGA-1288[1] | 35 W |
| Core i5-5xxUM | | | | 18 W |
Sandy Bridge | Core i5-2xxx T | 2, 4 | 6 MB | LGA 1155 | 35-45 W |
| Core i5-2xxx S | 4 | 6MB | LGA-1155 | 65W |
| Core i5-2xxx | 4 | 6MB | LGA-1155 | 95W |
Core i7
Codename | Brand name (list) | Cores | L3 Cache | Socket | TDP |
Gulftown | Core i7-980X | 6 | 12MB | LGA 1366 | 130 W |
| Core i7-970 | | | | |
Bloomfield | Core i7-9xx Extreme Edition | 4 | 8 MB | | |
| Core i7-9xx | | | | |
Lynnfield | Core i7-8xx | | | LGA 1156 | 95 W |
| Core i7-8xxS | | | | 82 W |
Clarksfield | Core i7-9xxXM Extreme Edition | | | µPGA-989 | 55 W |
| Core i7-8xxQM | | | | 45 W |
| Core i7-7xxQM | | 6 MB | | |
Arrandale | Core i7-6xxM | 2 | 4 MB | | 35 W |
| Core i7-6xxLM | | | 25 W | |
| Core i7-6xxUM | | | 18 W | |
sandy Bridge | Core i7-2xxx, 2xxxK | 4 | 8 MB | LGA 1155 | 95 W |
| Core i7-2xxxS | 4 | 8 MB | LGA 1155 | 65 W |
TDP - thermal design power
sometimes called thermal design point
LGA -Flip-Chip Land Grid Array
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